Patent Assignment Details
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| Reel/Frame: | 025068/0564 | |
| Pages: | 3 |
| | Recorded: | 09/30/2010 | | |
| Attorney Dkt #: | 812356 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12894468
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Filing Dt:
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09/30/2010
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Publication #:
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Pub Dt:
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04/07/2011
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Title:
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METHOD FOR GRINDING A SEMICONDUCTOR WAFER
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Assignee
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| HANNS-SEIDEL-PLATZ 4 |
| MUNICH, GERMANY 81737 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD. (FRANKFURT)
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TWO PRUDENTIAL PLAZA, SUITE 4900
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180 NORTH STETSON AVENUE
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CHICAGO, IL 60601-6731
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