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Patent Assignment Details
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Reel/Frame:025403/0566   Pages: 14
Recorded: 11/30/2010
Attorney Dkt #:24061.1636 (HYMITE)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 37
1
Patent #:
6832013
Issue Dt:
12/14/2004
Application #:
10030639
Filing Dt:
04/23/2002
Title:
HYBRID INTEGRATION OF ACTIVE AND PASSIVE OPTICAL COMPONENTS ON AN SI-BOARD
2
Patent #:
6786654
Issue Dt:
09/07/2004
Application #:
10224801
Filing Dt:
08/21/2002
Publication #:
US20040037519
Pub Dt:
02/26/2004
Title:
ENCAPSULATED OPTICAL FIBER END-COUPLED DEVICE
3
Patent #:
6818464
Issue Dt:
11/16/2004
Application #:
10264440
Filing Dt:
10/04/2002
Publication #:
US20030071283
Pub Dt:
04/17/2003
Title:
SEMICONDUCTOR STRUCTURE WITH ONE OR MORE THROUGH-HOLES
4
Patent #:
6969204
Issue Dt:
11/29/2005
Application #:
10305255
Filing Dt:
11/26/2002
Publication #:
US20040101259
Pub Dt:
05/27/2004
Title:
OPTICAL PACKAGE WITH AN INTEGRATED LENS AND OPTICAL ASSEMBLIES INCORPORATING THE PACKAGE
5
Patent #:
6856717
Issue Dt:
02/15/2005
Application #:
10395687
Filing Dt:
03/24/2003
Publication #:
US20040190836
Pub Dt:
09/30/2004
Title:
PACKAGE WITH A LIGHT EMITTING DEVICE
6
Patent #:
7213978
Issue Dt:
05/08/2007
Application #:
10437543
Filing Dt:
05/14/2003
Publication #:
US20030215194
Pub Dt:
11/20/2003
Title:
OPTICAL DEVICE RECEIVING SUBSTRATE AND OPTICAL DEVICE HOLDING CARRIER
7
Patent #:
7209235
Issue Dt:
04/24/2007
Application #:
10616521
Filing Dt:
07/10/2003
Publication #:
US20040051872
Pub Dt:
03/18/2004
Title:
ACCURATE POSITIONING OF COMPONENTS OF AN OPTICAL ASSEMBLY
8
Patent #:
NONE
Issue Dt:
Application #:
10699981
Filing Dt:
11/03/2003
Publication #:
US20050093667
Pub Dt:
05/05/2005
Title:
Three-dimensional inductive micro components
9
Patent #:
7165896
Issue Dt:
01/23/2007
Application #:
10777583
Filing Dt:
02/12/2004
Publication #:
US20050180698
Pub Dt:
08/18/2005
Title:
LIGHT TRANSMITTING MODULES WITH OPTICAL POWER MONITORING
10
Patent #:
7109580
Issue Dt:
09/19/2006
Application #:
10792529
Filing Dt:
03/03/2004
Publication #:
US20050194677
Pub Dt:
09/08/2005
Title:
HERMETICALLY SEALED PACKAGE FOR OPTICAL, ELECTRONIC, OPTO-ELECTRONIC AND OTHER DEVICES
11
Patent #:
7681306
Issue Dt:
03/23/2010
Application #:
10833428
Filing Dt:
04/28/2004
Publication #:
US20050241135
Pub Dt:
11/03/2005
Title:
A METHOD OF FORMING AN ASSEMBLY TO HOUSE ONE OR MORE MICRO COMPONENTS
12
Patent #:
7253388
Issue Dt:
08/07/2007
Application #:
10848498
Filing Dt:
05/17/2004
Publication #:
US20050236562
Pub Dt:
10/27/2005
Title:
ASSEMBLY WITH SELF-ALIGNMENT FEATURES TO POSITION A COVER ON A SUBSTRATE THAT SUPPORTS A MICRO COMPONENT
13
Patent #:
7553695
Issue Dt:
06/30/2009
Application #:
11082507
Filing Dt:
03/17/2005
Publication #:
US20060210234
Pub Dt:
09/21/2006
Title:
METHOD OF FABRICATIONG A PACKAGE FOR A MICRO COMPONENT
14
Patent #:
NONE
Issue Dt:
Application #:
11144429
Filing Dt:
06/02/2005
Publication #:
US20050269688
Pub Dt:
12/08/2005
Title:
Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package
15
Patent #:
7470622
Issue Dt:
12/30/2008
Application #:
11156170
Filing Dt:
06/17/2005
Publication #:
US20060283836
Pub Dt:
12/21/2006
Title:
FABRICATION AND USE OF POLISHED SILICON MICRO-MIRRORS
16
Patent #:
7419853
Issue Dt:
09/02/2008
Application #:
11202478
Filing Dt:
08/11/2005
Publication #:
US20070035001
Pub Dt:
02/15/2007
Title:
Method of fabrication for chip scale package for a micro component
17
Patent #:
7543999
Issue Dt:
06/09/2009
Application #:
11225758
Filing Dt:
09/12/2005
Publication #:
US20060072883
Pub Dt:
04/06/2006
Title:
OPTICAL MODULE HERMETICALLY PACKAGED IN MICRO-MACHINED STRUCTURES
18
Patent #:
7528422
Issue Dt:
05/05/2009
Application #:
11336094
Filing Dt:
01/20/2006
Publication #:
US20070170450
Pub Dt:
07/26/2007
Title:
PACKAGE FOR A LIGHT EMITTING ELEMENT WITH INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION
19
Patent #:
NONE
Issue Dt:
Application #:
11410475
Filing Dt:
04/24/2006
Publication #:
US20070274644
Pub Dt:
11/29/2007
Title:
Optical communication with wavelength separation
20
Patent #:
NONE
Issue Dt:
Application #:
11471414
Filing Dt:
06/19/2006
Publication #:
US20070292127
Pub Dt:
12/20/2007
Title:
Small form factor camera module with lens barrel and image sensor
21
Patent #:
7388285
Issue Dt:
06/17/2008
Application #:
11501139
Filing Dt:
08/08/2006
Publication #:
US20060273449
Pub Dt:
12/07/2006
Title:
HERMETICALLY SEALED PACKAGE FOR OPTICAL, ELECTRONIC, OPTO-ELECTRONIC AND OTHER DEVICES
22
Patent #:
8786165
Issue Dt:
07/22/2014
Application #:
11521828
Filing Dt:
09/15/2006
Publication #:
US20070063336
Pub Dt:
03/22/2007
Title:
QFN/SON COMPATIBLE PACKAGE WITH SMT LAND PADS
23
Patent #:
NONE
Issue Dt:
Application #:
11558175
Filing Dt:
11/09/2006
Publication #:
US20070120041
Pub Dt:
05/31/2007
Title:
Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same
24
Patent #:
7467897
Issue Dt:
12/23/2008
Application #:
11566448
Filing Dt:
12/04/2006
Publication #:
US20070091608
Pub Dt:
04/26/2007
Title:
LIGHT TRANSMITTING MODULES WITH OPTICAL POWER MONITORING
25
Patent #:
NONE
Issue Dt:
Application #:
11621045
Filing Dt:
01/08/2007
Publication #:
US20080164606
Pub Dt:
07/10/2008
Title:
SPACERS FOR WAFER BONDING
26
Patent #:
7531445
Issue Dt:
05/12/2009
Application #:
11669664
Filing Dt:
01/31/2007
Publication #:
US20080076195
Pub Dt:
03/27/2008
Title:
FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER STRUCTURES USING A THIN DIELECTRIC MEMBRANE
27
Patent #:
7732234
Issue Dt:
06/08/2010
Application #:
11675179
Filing Dt:
02/15/2007
Publication #:
US20080199982
Pub Dt:
08/21/2008
Title:
FABRICATION PROCESS FOR PACKAGE WITH LIGHT EMITTING DEVICE ON A SUB-MOUNT
28
Patent #:
7415180
Issue Dt:
08/19/2008
Application #:
11685494
Filing Dt:
03/13/2007
Publication #:
US20070153276
Pub Dt:
07/05/2007
Title:
ACCURATE POSITIONING OF COMPONENTS OF AN OPTICAL ASSEMBLY
29
Patent #:
NONE
Issue Dt:
Application #:
12014443
Filing Dt:
01/15/2008
Publication #:
US20090181500
Pub Dt:
07/16/2009
Title:
Fabrication of Compact Semiconductor Packages
30
Patent #:
7732829
Issue Dt:
06/08/2010
Application #:
12026113
Filing Dt:
02/05/2008
Publication #:
US20090194777
Pub Dt:
08/06/2009
Title:
OPTOELECTRONIC DEVICE SUBMOUNT
31
Patent #:
NONE
Issue Dt:
Application #:
12143003
Filing Dt:
06/20/2008
Publication #:
US20080315390
Pub Dt:
12/25/2008
Title:
Chip Scale Package For A Micro Component
32
Patent #:
7851818
Issue Dt:
12/14/2010
Application #:
12236182
Filing Dt:
09/23/2008
Publication #:
US20090321760
Pub Dt:
12/31/2009
Title:
FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES
33
Patent #:
8044412
Issue Dt:
10/25/2011
Application #:
12257203
Filing Dt:
10/23/2008
Publication #:
US20090101897
Pub Dt:
04/23/2009
Title:
PACKAGE FOR A LIGHT EMITTING ELEMENT
34
Patent #:
8309973
Issue Dt:
11/13/2012
Application #:
12369993
Filing Dt:
02/12/2009
Publication #:
US20100200888
Pub Dt:
08/12/2010
Title:
SILICON-BASED SUB-MOUNT FOR AN OPTO-ELECTRONIC DEVICE
35
Patent #:
7662710
Issue Dt:
02/16/2010
Application #:
12418923
Filing Dt:
04/06/2009
Publication #:
US20090191704
Pub Dt:
07/30/2009
Title:
FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER STRUCTURES USING A THIN DIELECTRIC MEMBRANE
36
Patent #:
NONE
Issue Dt:
Application #:
12430591
Filing Dt:
04/27/2009
Publication #:
US20100176507
Pub Dt:
07/15/2010
Title:
SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THROUGHS
37
Patent #:
7732240
Issue Dt:
06/08/2010
Application #:
12566136
Filing Dt:
09/24/2009
Publication #:
US20100015734
Pub Dt:
01/21/2010
Title:
FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER STRUCTURES USING A THIN DIELECTRIC MEMBRANE
Assignor
1
HYMITE A/S
Exec Dt:
08/09/2010
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE, SUITE 700
IP SECTION
DALLAS, TX 75219

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