Patent Assignment Details
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| Reel/Frame: | 043312/0566 | |
| Pages: | 9 |
| | Recorded: | 07/11/2017 | | |
| Attorney Dkt #: | US17097 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/08/2011
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Application #:
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12164422
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Filing Dt:
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06/30/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Title:
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METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD HAVING BURIED HOLES
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Assignee
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| XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO AN DISTRICT |
| SHENZHEN, CHINA |
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Correspondence name and address
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ZHIGANG MA
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550 S. HOPE STREET, SUITE 2825
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LOS ANGELES, CA 90071
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