Patent Assignment Details
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| Reel/Frame: | 027665/0567 | |
| Pages: | 3 |
| | Recorded: | 02/07/2012 | | |
| Attorney Dkt #: | PA0464-0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13367788
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Filing Dt:
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02/07/2012
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Publication #:
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Pub Dt:
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04/25/2013
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Title:
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SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING STACK PACKAGE USING THE SAME
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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WILLIAM PARK & ASSOCIATES LTD.
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930 N. YORK ROAD, SUITE 201
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HINSDALE, IL 60521
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