Patent Assignment Details
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Reel/Frame: | 033011/0568 | |
| Pages: | 5 |
| | Recorded: | 06/02/2014 | | |
Attorney Dkt #: | TSM10-0099CP1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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14249637
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Filing Dt:
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04/10/2014
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Publication #:
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Pub Dt:
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08/07/2014
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Title:
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3D Semiconductor Package Interposer with Die Cavity
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Assignee
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 R.O.C. |
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Correspondence name and address
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SLATER & MATSIL, L.L.P.
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17950 PRESTON ROAD
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SUITE 1000
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DALLAS, TX 75252
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