Patent Assignment Details
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| Reel/Frame: | 031632/0570 | |
| Pages: | 8 |
| | Recorded: | 11/19/2013 | | |
| Attorney Dkt #: | 10829-9097.US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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14084037
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Filing Dt:
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11/19/2013
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Publication #:
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Pub Dt:
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05/21/2015
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Title:
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UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES OR PACKAGES AND ASSOCIATED SYSTEMS AND METHODS
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Assignee
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| 8000 S. FEDERAL WAY, P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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