Patent Assignment Details
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Reel/Frame: | 018305/0571 | |
| Pages: | 2 |
| | Recorded: | 09/12/2006 | | |
Attorney Dkt #: | 59559.00037 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10592514
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Filing Dt:
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09/12/2006
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Publication #:
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Pub Dt:
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07/12/2007
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Title:
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Mold-clamping apparatus and method of adjusting mold thickness
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Assignee
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9-11, KITASHINAGAWA 5-CHOME |
SHINAGAWA-KU, TOKYO 141-8686, JAPAN |
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Correspondence name and address
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SQUIRE SANDERS & DEMPSEY L.L.P.
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8000 TOWERS CRESCENT DRIVE, 14TH FLOOR
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TYSONS CORNER, VIRGINIA 22182-2700
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