Patent Assignment Details
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Reel/Frame: | 059523/0571 | |
| Pages: | 2 |
| | Recorded: | 04/07/2022 | | |
Attorney Dkt #: | AP-304HC(2312PIAUS) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17715056
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Filing Dt:
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04/07/2022
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Publication #:
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Pub Dt:
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10/12/2023
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Title:
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ELECTRIC CONTACT STRUCTURE FOR THREE-DIMENSIONAL CHIP PACKAGE MODULE
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Assignee
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NO.18, BEIYUAN RD., ZHONGLI DIST. |
TAOYUAN CITY, TAIWAN |
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Correspondence name and address
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CHUN-HSIA CHEN
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P.O. BOX 90-3
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TAIPEI, 10699 TAIWAN
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09/23/2024 04:55 AM
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