Patent Assignment Details
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Reel/Frame: | 058126/0572 | |
| Pages: | 4 |
| | Recorded: | 11/16/2021 | | |
Attorney Dkt #: | MP9566 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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16748633
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Filing Dt:
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01/21/2020
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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HIGH DENSITY LOW POWER INTERCONNECT USING 3D DIE STACKING
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Assignee
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TAI SENG CENTRE |
3 IRVING ROAD #10-01 |
SINGAPORE, SINGAPORE 369522 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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