Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020871/0573 | |
| Pages: | 5 |
| | Recorded: | 04/29/2008 | | |
| Attorney Dkt #: | 0140130D |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11978026
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Filing Dt:
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10/26/2007
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Publication #:
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Pub Dt:
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03/13/2008
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Title:
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Method for fabricating a wafer level package having through wafer vias for external package connectivity
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Assignee
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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Correspondence name and address
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MICHAEL FARJAMI
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26522 LA ALAMEDA AVE., SUITE 360
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MISSION VIEJO, CA 92691
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