Patent Assignment Details
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Reel/Frame: | 030732/0573 | |
| Pages: | 3 |
| | Recorded: | 07/03/2013 | | |
Attorney Dkt #: | SAE-1307-USPT |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/09/2015
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Application #:
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13934186
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Filing Dt:
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07/02/2013
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Publication #:
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Pub Dt:
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01/09/2014
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Title:
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WAFER-LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME
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Assignee
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SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
HONG KONG, HONG KONG |
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Correspondence name and address
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B.Y.I.P., LTD
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P.O. BOX 1484, GENERAL POST OFFICE
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HONG KONG, HONG KONG
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