Patent Assignment Details
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Reel/Frame: | 014385/0576 | |
| Pages: | 3 |
| | Recorded: | 08/08/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/15/2005
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Application #:
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10636653
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Filing Dt:
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08/08/2003
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Publication #:
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Pub Dt:
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02/12/2004
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Title:
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Semiconductor device using an SOI substrate and having a trench isolation and method for fabricating the same
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Assignee
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1006, OAZA KADOMA,KADOMA-SHI |
OSAKA 571-8501, JAPAN |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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09/22/2024 09:15 AM
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