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Reel/Frame:056107/0576   Pages: 4
Recorded: 04/30/2021
Attorney Dkt #:010346-16001B-US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/14/2022
Application #:
15597069
Filing Dt:
05/16/2017
Publication #:
Pub Dt:
08/02/2018
Title:
Machine for Removing Substrate Material from Parts Produced by a 3-D Printer
Assignor
1
Exec Dt:
04/21/2021
Assignee
1
2495 MAIN STREET
SUITE 615
BUFFALO, NEW YORK 14214
Correspondence name and address
LEMPIA SUMMERFIELD KATZ LLC
20 SOUTH CLARK STREET
SUITE 600
CHICAGO, IL 60606

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