Patent Assignment Details
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| Reel/Frame: | 013236/0578 | |
| Pages: | 4 |
| | Recorded: | 08/23/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10226572
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Filing Dt:
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08/23/2002
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Publication #:
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Pub Dt:
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08/07/2003
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Title:
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Method of forming semiconductor device
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Assignee
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| NO. 119, GWANGFU N. RD. |
| HSIN-CHU INDUSTRY DISTRICT, HUKO SHIANG |
| HSINCHU, TAIWAN 303 R.O.C. |
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Correspondence name and address
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PERKINS COIE LLP
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CHUNG M. NG
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P.O. BOX 1247
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PATENT-SEA
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SEATTLE, WA 98111-1247
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