Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018330/0578 | |
| Pages: | 4 |
| | Recorded: | 09/27/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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06/07/2011
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Application #:
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10836096
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Filing Dt:
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04/30/2004
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Publication #:
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Pub Dt:
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11/03/2005
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Title:
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METHOD OF OVERMOLDING A SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11429706
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Filing Dt:
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05/08/2006
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Publication #:
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Pub Dt:
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09/14/2006
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Title:
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Overmolded substrate
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Assignee
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| 710 MEDTRONIC PARKWAY NE |
| MINNEAPOLIS, MINNESOTA 55432-5604 |
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Correspondence name and address
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WILLIAM D. BAUER
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IPLM GROUP, P.A.
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P.O. BOX 18455
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MINNEAPOLIS, MN 55418
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