Patent Assignment Details
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| Reel/Frame: | 046835/0578 | |
| Pages: | 3 |
| | Recorded: | 09/11/2018 | | |
| Attorney Dkt #: | 106P001258US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/25/2020
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Application #:
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16127357
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Filing Dt:
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09/11/2018
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Publication #:
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Pub Dt:
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06/20/2019
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Title:
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LED PACKAGE STRUCTURE, HEAT-DISSIPATING SUBSTRATE, AND METHOD FOR MANUFACTURING HEAT-DISSIPATING SUBSTRATE
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Assignee
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| 22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST. |
| TAIPEI CITY, TAIWAN |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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