Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 052049/0580 | |
| Pages: | 46 |
| | Recorded: | 02/28/2020 | | |
| Attorney Dkt #: | FSC75398C01US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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16804662
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Filing Dt:
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02/28/2020
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Publication #:
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Pub Dt:
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06/18/2020
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Title:
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SEMICONDUCTOR DIE PACKAGE INCLUDING A ONE-BODY CLIP
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Assignee
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| 5005 E. MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MAILDROP A700
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PHOENIX, AZ 85008
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05/23/2024 08:47 PM
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