Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 019468/0581 | |
| Pages: | 3 |
| | Recorded: | 06/22/2007 | | |
| Attorney Dkt #: | 1003.2.1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11744096
|
Filing Dt:
|
05/03/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/08/2007
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
|
|
|
Assignee
|
|
|
|
|
| 373-1, GUSEONG-DONG, YUSEONG-KU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
|
|
Correspondence name and address
|
| |
CRAIG METCALF
|
| |
2795 EAST COTTONWOOD PARKWAY
|
| |
SUITE 155
|
| |
SALT LAKE CITY, UT 84121
|
Search Results as of:
09/25/2024 07:53 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
