Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 034656/0581 | |
| Pages: | 3 |
| | Recorded: | 01/07/2015 | | |
| Attorney Dkt #: | 29029-28005/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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14577369
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Filing Dt:
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12/19/2014
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Publication #:
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Pub Dt:
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04/16/2015
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Title:
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Debonding Temporarily Bonded Semiconductor Wafers
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Assignee
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| SCHLEISSHEIMER STR. 90 |
| GARCHING, GERMANY 85748 |
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Correspondence name and address
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PAUL A. SMITH
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FENWICK & WEST LLP
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801 CALIFORNIA STREET
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MOUNTAIN VIEW, CA 94041
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