Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018037/0583 | |
| Pages: | 3 |
| | Recorded: | 06/27/2006 | | |
| Attorney Dkt #: | YEWM3001/EM |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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11475131
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Filing Dt:
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06/27/2006
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Publication #:
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Pub Dt:
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12/27/2007
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Title:
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3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE
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Assignee
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| NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP |
| HSINCHU CITY 303, TAIWAN R.O.C. |
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Correspondence name and address
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BACON & THOMAS, PLLC
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625 SLATERS LANE
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FOURTH FLOOR
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ALEXANDRIA, VA 22314
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