Patent Assignment Details
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Reel/Frame: | 018390/0584 | |
| Pages: | 3 |
| | Recorded: | 10/13/2006 | | |
Attorney Dkt #: | 19227-US-PA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11535991
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Filing Dt:
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09/28/2006
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Publication #:
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Pub Dt:
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08/23/2007
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Title:
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LIGHT EMITTING DIODE PACKAGE AND FABRICATING METHOD THEREOF
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Assignee
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5F, NO 251, SEC. 1, CHUNGHUA RD. |
HSINCHU CITY, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2
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TAIPEI, 100 TAIWAN
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