Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 024126/0584 | |
| Pages: | 3 |
| | Recorded: | 03/24/2010 | | |
Attorney Dkt #: | VISH-8794 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2013
|
Application #:
|
12730230
|
Filing Dt:
|
03/24/2010
|
Publication #:
|
|
Pub Dt:
|
07/21/2011
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES INCLUDING DIE AND L-SHAPED LEAD AND METHOD OF MANUFACTURE
|
|
Assignee
|
|
|
2201 LAURELWOOD ROAD |
SANTA CLARA, CALIFORNIA 95054 |
|
Correspondence name and address
|
|
VISHAY/SILICONIX C/O MURABITO, HAO & BAR
|
|
2 N. MARKET STREET
|
|
THIRD FLOOR
|
|
SAN JOSE, CA 95113
|
Search Results as of:
09/22/2024 02:50 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|