Patent Assignment Details
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| Reel/Frame: | 013891/0585 | |
| Pages: | 4 |
| | Recorded: | 03/20/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10393238
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Filing Dt:
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03/20/2003
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Publication #:
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Pub Dt:
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10/30/2003
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Title:
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Second level packaging interconnection method with improved thermal and reliability performance
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Assignee
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| KEILALANDENTIE 4 |
| FIN-02150 ESPOO, FINLAND |
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Correspondence name and address
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NOKIA INC.
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STEVEN A. SHAW, ESQ.
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MS 1-4-755
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6000 CONNECTION DRIVE
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IRVING, TEXAS 75039
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