Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 029167/0585 | |
| Pages: | 12 |
| | Recorded: | 10/22/2012 | | |
| Attorney Dkt #: | CU-9984 KSV/MH |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13642713
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Filing Dt:
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10/22/2012
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Publication #:
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Pub Dt:
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02/14/2013
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Title:
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SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFACTURING METHOD THEREOF
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Assignee
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| IN SEOUL NATIONAL UNIVERSITY OF TECHNOLOGY, 172 GONGNEUNG-DONG, NOWONGU |
| SEOUL, KOREA, REPUBLIC OF 139-743 |
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Correspondence name and address
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RICHARD J. STREIT
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LADAS & PARRY, 224 SOUTH MICHIGAN AVE.
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CHICAGO, IL 60604
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