Patent Assignment Details
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| Reel/Frame: | 057084/0585 | |
| Pages: | 12 |
| | Recorded: | 08/04/2021 | | |
| Attorney Dkt #: | PSMP0011USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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17394372
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Filing Dt:
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08/04/2021
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Publication #:
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Pub Dt:
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04/28/2022
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Title:
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THROUGH SILICON VIA AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| NO.18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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06/28/2024 02:20 PM
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