Patent Assignment Details
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Reel/Frame: | 012297/0586 | |
| Pages: | 8 |
| | Recorded: | 11/05/2001 | | |
Conveyance: | CORRECTION TO INVENTORS NAMES |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/03/2005
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Application #:
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09929350
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Filing Dt:
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08/15/2001
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Publication #:
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Pub Dt:
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02/27/2003
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Title:
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INTERNAL HYDROGEN SOURCES FOR HEAT CONDUCTIVE PACKAGING OF LOW DIELECTRIC CONSTANT SEMICONDUCTOR CHIPS, AND METHOD OF PROVIDING HYDROGEN THEREFOR
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Assignee
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8000 S. FEDERAL WAY |
BOISE, IDAHO 83707 |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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THOMAS J. D'AMICO
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2101 L STREET, NW
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WASHINGTON, DC 20037-1526
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