Patent Assignment Details
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Reel/Frame: | 047834/0588 | |
| Pages: | 3 |
| | Recorded: | 12/20/2018 | | |
Attorney Dkt #: | 11106/1147 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16227486
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Filing Dt:
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12/20/2018
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Publication #:
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Pub Dt:
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08/08/2019
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Title:
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SEMICONDUCTOR DEVICE WITH SIDE WALL PROTECTION FILM FOR BOND PAD AND WIRING
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Assignee
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8, NAKASE 1-CHOME, MIHAMA-KU |
CHIBA-SHI, CHIBA, JAPAN 261-8507 |
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Correspondence name and address
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TADASHI HORIE / MARIA CAMACHO
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BRINKS GILSON & LIONE
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PO BOX 10395
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CHICAGO, IL 60610
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09/23/2024 03:10 AM
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