Patent Assignment Details
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| Reel/Frame: | 059186/0589 | |
| Pages: | 3 |
| | Recorded: | 03/07/2022 | | |
| Attorney Dkt #: | 2022-0195A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17640973
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Filing Dt:
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03/07/2022
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Publication #:
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Pub Dt:
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08/25/2022
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Title:
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POLYAMIDE RESIN COMPOSITION AND POLYAMIDE RESIN MOLDED ARTICLE
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Assignee
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| 2-8, DOJIMA HAMA 2-CHOME |
| KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5308230 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1025 CONNECTICUT AVENUE NW
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SUITE 500
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WASHINGTON, DC 20036
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