Patent Assignment Details
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| Reel/Frame: | 017198/0591 | |
| Pages: | 2 |
| | Recorded: | 01/19/2006 | | |
| Attorney Dkt #: | 022111-000700US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/08/2003
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Application #:
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09887646
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Filing Dt:
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06/22/2001
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Publication #:
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Pub Dt:
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04/25/2002
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Title:
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METHOD FOR SAWING A MOULDED LEADFRAME PACKAGE
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Assignee
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| LEVEL 9, WISMA HONG LEONG |
| 18 JALAN PERAK |
| KUALA LUMPUR, MALAYSIA 50450 |
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Correspondence name and address
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WILLIAM L. SHAFFER
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER, EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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