Patent Assignment Details
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Reel/Frame: | 031894/0591 | |
| Pages: | 4 |
| | Recorded: | 01/06/2014 | | |
Attorney Dkt #: | 29925/43251A |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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14059756
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Filing Dt:
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10/22/2013
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Publication #:
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Pub Dt:
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02/13/2014
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Title:
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METHOD FOR FABRICATING AN INTER DIELECTRIC LAYER IN SEMICONDUCTOR DEVICE
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Assignee
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2091 GYEONGCHUNG-DAERO, BUBAL-EUB |
ICHEON-SI, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARSHALL, GERSTEIN & BORUN LLP
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233 SOUTH WACKER DRIVE
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6300 WILLIS TOWER
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CHICAGO, IL 60606-6357
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