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Reel/Frame:040493/0591   Pages: 3
Recorded: 12/02/2016
Attorney Dkt #:OPX16141-097US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/25/2019
Application #:
15367368
Filing Dt:
12/02/2016
Publication #:
Pub Dt:
01/18/2018
Title:
METHOD FOR MANUFACTURING THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Assignors
1
Exec Dt:
11/02/2016
2
Exec Dt:
11/02/2016
Assignee
1
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
IP & T GROUP LLP
8230 LEESBURG PIKE SUITE 650
VIENNA, VA 22182

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