Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 030308/0592 | |
| Pages: | 3 |
| | Recorded: | 04/29/2013 | | |
| Attorney Dkt #: | 12062-235 (F2547PCT-US) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13882359
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Filing Dt:
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04/29/2013
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Publication #:
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Pub Dt:
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08/29/2013
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Title:
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MOLDING DIE, MICROCHIP MANUFACTURED BY USING MOLDING DIE, AND MANUFACTURING APPARATUS FOR MANUFACTURING MICROCHIP
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Assignee
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| 2-7-2 MARUNOUCHI, CHIYODA-KU |
| TOKYO, JAPAN 100-7015 |
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Correspondence name and address
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BRINKS HOFER GILSON & LIONE
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P.O. BOX 10395
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CHICAGO, IL 60610
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