Patent Assignment Details
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Reel/Frame: | 035480/0592 | |
| Pages: | 5 |
| | Recorded: | 04/23/2015 | | |
Attorney Dkt #: | 103P001216US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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14694256
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Filing Dt:
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04/23/2015
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Publication #:
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Pub Dt:
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04/21/2016
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Title:
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MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE
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Assignees
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12F., NO.368, GONGJIAN RD., XIZHI DIST. |
NEW TAIPEI CITY, TAIWAN 221 |
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6F., NO.366, GONGJIAN RD., XIZHI DIST. |
NEW TAIPEI CITY, TAIWAN 221 |
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Correspondence name and address
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
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3057 NUTLEY STREET
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SUITE 818
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FAIRFAX, VA 22031
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