Patent Assignment Details
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Reel/Frame: | 065148/0592 | |
| Pages: | 6 |
| | Recorded: | 10/06/2023 | | |
Attorney Dkt #: | AF2830-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17846153
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Filing Dt:
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06/22/2022
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Publication #:
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Pub Dt:
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12/28/2023
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Title:
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PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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MANJULA VARIYAM
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4757 W PARK BLVD, STE 113-1026
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AKONA IP
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PLANO, TX 75093
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06/14/2024 09:17 AM
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