Patent Assignment Details
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Reel/Frame: | 018696/0593 | |
| Pages: | 3 |
| | Recorded: | 12/12/2006 | | |
Attorney Dkt #: | LEE.111 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/16/2008
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Application #:
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11636995
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Filing Dt:
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12/12/2006
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Publication #:
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Pub Dt:
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07/26/2007
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Title:
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METHOD FOR MAKING FLIP CHIP ON LEADFRAME PACKAGE
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Assignee
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26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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ANDREW J. TELESZ, JR.
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VOLENTINE FRANCOS & WHITT, P.L.L.C.
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11951 FREEDOM DRIVE, SUITE 1260
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RESTON, VA 20190
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