Patent Assignment Details
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Reel/Frame: | 053253/0593 | |
| Pages: | 4 |
| | Recorded: | 07/20/2020 | | |
Attorney Dkt #: | 00258.0048.00US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/25/2020
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Application #:
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16236564
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Filing Dt:
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12/30/2018
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Publication #:
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Pub Dt:
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04/30/2020
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Title:
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WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MATERIAL
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Assignee
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BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
NINGBO, CHINA 315800 |
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Correspondence name and address
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ANOVA LAW GROUP C/O SMIC
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21495 RIDGETOP CIRCLE
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SUITE 300
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STERLING, VA 20166
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09/25/2024 06:54 AM
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