Patent Assignment Details
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| Reel/Frame: | 012737/0594 | |
| Pages: | 3 |
| | Recorded: | 01/07/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09624065
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Filing Dt:
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07/24/2000
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE WITH EXPOSED DIE PAD
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Assignee
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN
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STEVEN M. JENSEN
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EDWARDS & ANGELL, LLP
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P.O. BOX 9169
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BOSTON, MA 02209
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