Patent Assignment Details
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Reel/Frame: | 055268/0594 | |
| Pages: | 3 |
| | Recorded: | 02/16/2021 | | |
Attorney Dkt #: | DI77951-US-PCN |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17035996
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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01/14/2021
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Title:
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HIGH MODULUS, TOUGHENED ONE-COMPONENT EPOXY STRUCTURAL ADHESIVES WITH HIGH ASPECT RATIO FILLERS
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Assignee
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BACHTOBELSTRASSE 3 |
HORGEN, SWITZERLAND CH-8810 |
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Correspondence name and address
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DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
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974 CENTRE ROAD
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BLDG 730
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WILMINGTON, DE 19805
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