Patent Assignment Details
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Reel/Frame: | 012102/0595 | |
| Pages: | 2 |
| | Recorded: | 08/18/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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09932053
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Filing Dt:
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08/18/2001
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Publication #:
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Pub Dt:
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07/04/2002
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Title:
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SEMICONDUCTOR PACKAGE HAVING VERTICALLY MOUNTED PASSIVE DEVICES UNDER A CHIP AND A FABRICATING METHOD THEREOF
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Assignee
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TANTZU |
NO. 123, SEC. 3, DA FONG ROAD |
TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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EDWARDS & ANGELL, LLP
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PETER F. CORLESS
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P.O. BOX 9169
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BOSTON, MA 02209
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