Patent Assignment Details
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Reel/Frame: | 037170/0595 | |
| Pages: | 3 |
| | Recorded: | 11/30/2015 | | |
Attorney Dkt #: | 4875.6150001 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/05/2017
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Application #:
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14954679
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Filing Dt:
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11/30/2015
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Publication #:
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Pub Dt:
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04/27/2017
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Title:
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Fan-out 3D IC Integration Structure without Substrate and Method of Making the Same
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Assignee
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5300 CALIFORNIA AVENUE |
IRVINE, CALIFORNIA 92617 |
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Correspondence name and address
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STERNE KESSLER GOLDSTEIN & FOX
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1100 NEW YORK AVENUE, NW
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WASHINGTON, DC 20005
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09/22/2024 03:04 PM
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