skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:054036/0599   Pages: 49
Recorded: 10/09/2020
Attorney Dkt #:76809US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 224
Page 3 of 3
Pages: 1 2 3
1
Patent #:
6418033
Issue Dt:
07/09/2002
Application #:
09714311
Filing Dt:
11/16/2000
Title:
MICROELECTRONIC PACKAGES IN WHICH SECOND MICROELECTRONIC SUBSTRATES ARE ORIENTED RELATIVE TO FIRST MICROELECTRONIC SUBSTRATES AT ACUTE ANGLES
2
Patent #:
6342406
Issue Dt:
01/29/2002
Application #:
09714682
Filing Dt:
11/15/2000
Title:
Flip chip on glass image sensor package fabrication method
3
Patent #:
6340846
Issue Dt:
01/22/2002
Application #:
09730721
Filing Dt:
12/06/2000
Title:
Making semiconductor packages with stacked dies and reinforced wire bonds
4
Patent #:
6448506
Issue Dt:
09/10/2002
Application #:
09752662
Filing Dt:
12/28/2000
Title:
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD FOR MAKING THE PACKAGE
5
Patent #:
6420201
Issue Dt:
07/16/2002
Application #:
09754229
Filing Dt:
01/03/2001
Title:
METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE
6
Patent #:
6432737
Issue Dt:
08/13/2002
Application #:
09754239
Filing Dt:
01/03/2001
Title:
METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE
7
Patent #:
6441503
Issue Dt:
08/27/2002
Application #:
09754393
Filing Dt:
01/03/2001
Title:
BOND WIRE PRESSURE SENSOR DIE PACKAGE
8
Patent #:
6445075
Issue Dt:
09/03/2002
Application #:
09770859
Filing Dt:
01/26/2001
Title:
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE
9
Patent #:
6494361
Issue Dt:
12/17/2002
Application #:
09770861
Filing Dt:
01/26/2001
Title:
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
10
Patent #:
6476331
Issue Dt:
11/05/2002
Application #:
09783797
Filing Dt:
02/14/2001
Title:
PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
11
Patent #:
6392163
Issue Dt:
05/21/2002
Application #:
09790421
Filing Dt:
02/22/2001
Publication #:
US20020020551
Pub Dt:
02/21/2002
Title:
CONTROLLED-SHAPED SOLDER RESERVOIRS FOR INCREASING THE VOLUME OF SOLDER BUMPS
12
Patent #:
6399463
Issue Dt:
06/04/2002
Application #:
09797756
Filing Dt:
03/01/2001
Title:
METHOD OF SINGULATION USING LASER CUTTING
13
Patent #:
6420776
Issue Dt:
07/16/2002
Application #:
09797759
Filing Dt:
03/01/2001
Title:
STRUCTURE INCLUDING ELECTRONIC COMPONENTS SINGULATED USING LASER CUTTING
14
Patent #:
6455927
Issue Dt:
09/24/2002
Application #:
09804749
Filing Dt:
03/12/2001
Title:
MICROMIRROR DEVICE PACKAGE
15
Patent #:
6486537
Issue Dt:
11/26/2002
Application #:
09812426
Filing Dt:
03/19/2001
Title:
SEMICONDUCTOR PACKAGE WITH WARPAGE RESISTANT SUBSTRATE
16
Patent #:
6437449
Issue Dt:
08/20/2002
Application #:
09828396
Filing Dt:
04/06/2001
Title:
MAKING SEMICONDUCTOR DEVICES HAVING STACKED DIES WITH BIASED BACK SURFACES
17
Patent #:
6420204
Issue Dt:
07/16/2002
Application #:
09839861
Filing Dt:
04/20/2001
Publication #:
US20010014486
Pub Dt:
08/16/2001
Title:
METHOD OF MAKING A PLASTIC PAKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE
18
Patent #:
6429513
Issue Dt:
08/06/2002
Application #:
09866100
Filing Dt:
05/25/2001
Title:
ACTIVE HEAT SINK FOR COOLING A SEMICONDUCTOR CHIP
19
Patent #:
6417576
Issue Dt:
07/09/2002
Application #:
09884357
Filing Dt:
06/18/2001
Title:
METHOD AND APPARATUS FOR ATTACHING MULTIPLE METAL COMPONENTS TO INTEGRATED CIRCUIT MODULES
20
Patent #:
6399418
Issue Dt:
06/04/2002
Application #:
09916719
Filing Dt:
07/26/2001
Title:
METHOD FOR FORMING A REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE
21
Patent #:
6486545
Issue Dt:
11/26/2002
Application #:
09916848
Filing Dt:
07/26/2001
Title:
PRE-DRILLED BALL GRID ARRAY PACKAGE
22
Patent #:
6476476
Issue Dt:
11/05/2002
Application #:
09932109
Filing Dt:
08/16/2001
Title:
INTEGRATED CIRCUIT PACKAGE INCLUDING PIN AND BARREL INTERCONNECTS
23
Patent #:
6396130
Issue Dt:
05/28/2002
Application #:
09953422
Filing Dt:
09/14/2001
Title:
SEMICONDUCTOR PACKAGE HAVING MULTIPLE DIES WITH INDEPENDENTLY BIASED BACK SURFACES
24
Patent #:
9389689
Issue Dt:
07/12/2016
Application #:
14105903
Filing Dt:
12/13/2013
Publication #:
US20140184946
Pub Dt:
07/03/2014
Title:
Touch Screen Device
Assignor
1
AMKOR TECHNOLOGY, INC.
Exec Dt:
11/19/2019
Assignee
1
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
491 B RIVER VALLEY ROAD
#15-02/04
VALLEY POINT, SINGAPORE 248373
Correspondence name and address
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
34TH FLOOR
CHICAGO, IL 60661

Search Results as of: 09/23/2024 06:21 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT