Patent Assignment Details
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| Reel/Frame: | 022595/0599 | |
| Pages: | 3 |
| | Recorded: | 04/24/2009 | | |
| Attorney Dkt #: | CS2008/120 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/22/2011
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Application #:
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12429916
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Filing Dt:
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04/24/2009
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Publication #:
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Pub Dt:
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10/28/2010
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D |
| STREET 2 |
| SINGAPORE 738406, SINGAPORE |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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