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Patent Assignment Details
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Reel/Frame:005701/0600   Pages: 3
Recorded: 05/03/1991
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
01/12/1993
Application #:
07662752
Filing Dt:
03/01/1991
Title:
RESIN SEALED SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Assignor
1
Exec Dt:
03/01/1991
Assignee
1
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondence name and address
LAFFF, WHITESEL,
CONTE & SARET
401 N. MICHIGAN AVE.
CHICAGO, IL 60611

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