Patent Assignment Details
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| Reel/Frame: | 022070/0601 | |
| Pages: | 6 |
| | Recorded: | 01/07/2009 | | |
| Attorney Dkt #: | P24324 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/09/2010
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Application #:
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11537522
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Filing Dt:
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09/29/2006
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Publication #:
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Pub Dt:
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04/03/2008
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Title:
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DUAL-CHIP INTEGRATED HEAT SPREADER ASSEMBLY, PACKAGES CONTAINING SAME, AND SYSTEMS CONTAINING SAME
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Assignee
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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INTEL CORPORATION, C/O INTELLEVATE, LLC
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P.O. BOX 52050
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MINNEAPOLIS, MN 55402
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