Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 037583/0601 | |
| Pages: | 5 |
| | Recorded: | 01/26/2016 | | |
| Attorney Dkt #: | 251325-6680 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15006386
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Filing Dt:
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01/26/2016
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Publication #:
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Pub Dt:
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10/20/2016
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Title:
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BONDING PAD ARRANGMENT DESIGN FOR SEMICONDUCTOR PACKAGE
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Assignee
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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3100 INTERSTATE NORTH CIRCLE
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SUITE 150
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ATLANTA, GA 30339
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