Patent Assignment Details
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| Reel/Frame: | 013465/0602 | |
| Pages: | 5 |
| | Recorded: | 11/07/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/26/2008
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Application #:
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10233117
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Filing Dt:
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08/30/2002
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Publication #:
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Pub Dt:
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03/04/2004
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Title:
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METHOD FOR PROCESSING A SEMICONDUCTOR WAFER INCLUDING BACK SIDE GRINDING
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Assignee
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| 7200 N.W. FRONT AVENUE |
| PORTLAND, OREGON 97210 |
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Correspondence name and address
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KOLISCH, HARTWELL, DICKINSON ET AL
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OWEN W. DUKELOW
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520 S.W. YAMHILL STREET, SUITE 200
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PORTLAND, OREGON 97204
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