Patent Assignment Details
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Reel/Frame: | 007049/0605 | |
| Pages: | 2 |
| | Recorded: | 06/14/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/05/1996
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Application #:
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08259615
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Filing Dt:
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06/14/1994
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Title:
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METHOD FOR SIMULATING MOLD FILLING OF SEMI-SOLID MATERIALS
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Assignee
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20 THORNWOOD DRIVE, SUITE 220 |
ITHACA, NEW YORK 14850 |
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Correspondence name and address
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MICHAEL F. BROWN
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BARNARD, BROWN & MICHAELS
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306 E. STATE ST., SUITE 220
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ITHACA, NY 14850
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