Patent Assignment Details
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Reel/Frame: | 061380/0605 | |
| Pages: | 4 |
| | Recorded: | 10/11/2022 | | |
Attorney Dkt #: | 00283.0008.01US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17963649
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Filing Dt:
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10/11/2022
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Publication #:
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Pub Dt:
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02/02/2023
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Title:
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HYBRID WAFER BONDING METHOD
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Assignee
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18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
WUHAN, CHINA 430074 |
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Correspondence name and address
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ANOVA LAW GROUP, PLLC
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21495 RIDGETOP CIRCLE, SUITE 300
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STERLING, VA 20166
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09/25/2024 11:40 PM
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