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Reel/Frame:025637/0606   Pages: 14
Recorded: 01/13/2011
Attorney Dkt #:ASEG-045/01US 307632-2071
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/29/2013
Application #:
13006340
Filing Dt:
01/13/2011
Publication #:
Pub Dt:
07/14/2011
Title:
SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFACTURING METHODS THEREOF
Assignors
1
Exec Dt:
01/13/2011
2
Exec Dt:
01/13/2011
3
Exec Dt:
01/13/2011
4
Exec Dt:
01/13/2011
5
Exec Dt:
01/13/2011
6
Exec Dt:
01/13/2011
7
Exec Dt:
01/13/2011
8
Exec Dt:
01/13/2011
Assignee
1
26 CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOSIUNG R.O.C., TAIWAN
Correspondence name and address
COOLEY LLP ATTN: PATENT GROUP
SUITE 1100
777 - 6TH STREET, NW
WASHINGTON, DC 20001

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