Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027082/0607 | |
| Pages: | 4 |
| | Recorded: | 08/18/2011 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY'S NAME PREVIOUSLY RECORDED ON REEL 015442 FRAME 0056, THE ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
6
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Patent #:
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Issue Dt:
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12/21/1999
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Application #:
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09081898
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Filing Dt:
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05/20/1998
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Title:
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TIRE VALVE AND ASSOCIATED TIRE PRESSURE SENDING UNIT
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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09270802
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Filing Dt:
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03/17/1999
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Title:
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FLAT MULTIPLE-CHIP MODULE MICRO BALL GRID ARRAY PACKAGING
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Patent #:
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Issue Dt:
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02/08/2000
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Application #:
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09271214
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Filing Dt:
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03/17/1999
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Title:
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STACKED MULTIPLE-CHIP MODULE MICRO BALL GRID ARRAY PACKAGING
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Patent #:
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Issue Dt:
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10/24/2000
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Application #:
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09318943
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Filing Dt:
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05/26/1999
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Title:
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HYBRID ASIC/MEMORY MODULE PACKAGE
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Patent #:
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Issue Dt:
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03/18/2003
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Application #:
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09873420
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Filing Dt:
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06/05/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Title:
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SEMICONDUCTOR WAFER DESIGNED TO AVOID PROBED MARKS WHILE TESTING
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09873421
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Filing Dt:
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06/05/2001
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Title:
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MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICES
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Assignee
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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Correspondence name and address
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CHE-YANG CHEN
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7309 TERESA AVENUE
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ROSEMEND, CA 91770
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